Solution Characteristic of CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board
CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board is a variety of lower viscosity, Inherent flame resistance, two elements addtion fixed potting silicone with warmth-conducting. It cures with equally on room temperature and heated temperature. It has the feature of the increased temperature the faster of the curing time. CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board can be applied to digital components for insulation, waterproofing, set and flame retardant. The flame retardant UL94-V0 level can be achieved. It primarily applied in digital factors surface area with materials of Laptop(CZPT-carbonate), PP, Abs, PVC, and so forth. And steel materials.

Standard Application of CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board
CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board is ideal for
– substantial run electronics,
– DC/DC module and circuit board which demands warmth dissipation and large temperature resistance.
It can be broadly utilized for LED display screen, Wind Electrical power Generator, PCB substrate, etc.

CZPT Parameters of CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board
Functions Portion A Portion B
Prior to Curing
Appearence Grey Fluid White Fluid
Viscosisty(25° Ccps) 3000± 500 3000± five hundred

Procedure characteristics
Mixing Ratio one: one
Viscosisty(right after mixing) (cps) 2500~3500
Working Time(25° C hr) 120
Curing time (min, 25° C) 480
Curing time(80° C hr 20

Right after Curing
Hardness(Shore A) 55± five
Thermal conductivity [W(m· K)] ≥ .8
Dielectric CZPT(KV/mm) ≥ 25
Permittivity(one.2MHz) three.~three.three
Volume Resisivity(Ω · Cm) ≥ 1.0× 1016
Linear expansibility [m/(m· K)] ≤ two.2× 10-four
Fireplace Resistance 94-V0
(Pls be aware: The above info for this item in twenty five ° C temperature, fifty five % humidity circumstances, for reference. The accurate info is calculated by buyers to when employing. )

Technical XIHU (WEST LAKE) DIS.Traces for CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board
1, Pls place portion A and component B in different container and stir evenly prior to mixing the two portion together.
2, Fat Ratio: Component A: Component B = one: 1
three, Deaeration the combination in vacuum pump beneath .08 MPa for 3-5 minutes.
four, The temperature influences the curing time of HY-9060#. When in as well reduced temperature, we suggest consumers appropriately heat the mixture to accelerate vulcanization. Advised procedure time and temperature. With temperature of 80~100° C, the silicone will treatment in fifteen minutes, even though in 25° C room temperature, the silicone will remedy all around 8 hrs.

Heat Ideas of CZPTtronic Encapsulation Silicone CZPT for CZPTtronic Board:
1. The pursuing substance may possibly hinder the curing of the product, So pls apply after summary experiment. When needed, pls thoroughly clean the application areas.
Condensation silicone which not totally fixed or organic and natural tin compounds
Sulphur, sulfide and sulfur rubber materials.
Amine compounds as effectively as consists of the amine materials.
Pewters solder flux.
two. Ought to be sealed storage. The mixture should be utilized up at after, avoid leading to squander.
three. Silicone belongs to non-unsafe merchandise, but keep absent from mouth and eyes.
4. When it receives stratified right after a time period of storage, You should mix 9060 evenly before using, it does not influence the efficiency

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